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【summary】
Laser scribing and laser drilling technology occupy an important position: in the processing equipment, high-pulse CO2 lasers can be used to perforate the film layer of packaging materials. Special technology, each hole is melted around, which can effectively prevent the expansion of the hole, avoid corrupted packages
Before the 1980s, most consumers did not pay much attention to cooking food with a household microwave oven. Since the 1990s, microwave technology has been greatly improved, especially the popularization of components of small kitchen appliances such as microwave ovens and ovens, and microwave foods have also begun to increase. Now the pace of life is getting faster and faster. Consumers not only need higher quality food, but also need convenient packaging and faster and more efficient cooking methods. Microwave food has become a necessity in life. Correspondingly, microwave food packaging has experienced a wave of technological innovation and has played a new vitality.
At present, it occupies an important position in the field of laser scribing and laser punching technology: in processing equipment, high-pulse CO2 laser punchingThe film layer of the packaging material can be punched with a special technology, and each hole is melted around, which can effectively prevent the expansion of the hole and avoid destroying the integrity of the packaging, while having a good breathable and moisturizing effect.
In addition, when the packaging belt needs to have holes, the laser system can punch holes for "ventilation and freshness preservation" on the packaging. Punching holes can extend the shelf life of the goods in the package, or cater to the pressure on the food packaging after the product is heated in a microwave oven.
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