Ceramic Laser Scratching | Laser Panel Depaneling Case

Laser Ceramic Scratching

Laser erosion of ceramic substrates creates a well-defined fracture line in the material, allowing its clean and precise separation into individual parts (splitting).

Depending on the application requirements and the laser source selected for this, the substrates are processed using fixed optics or galvo scanners. Ultrasonic pulsed lasers produce scratch-free ridges and low thermal material tensions through a near-cold process.

Typical materials: AlOx, AlN, DCB substrate, composite ceramics

Using Laser to Mark Circuit Boards

Advantages: Fast, flexible, no residue

• Scirping is a process used to pre-cut printed circuit boards. Predetermined breaking points are created on the edges of the panels so that they can later be broken quickly and easily along the predetermined breaking points.

• All circuit boards with a thickness of 0.3mm to 2mm can be scribed.

What are the advantages of laser scribing:

1. No mechanical stress or damage due to non-contact and vibration-free scraping

2. Increased yield: Reliability of circuits significantly improved

3. Reduced material usage by optimizing utilization benefits

   gt;

4. Technical cutting-edge cleanliness

5. Dust-free handling (through evaporation and suction of materials)

6. Flexibility in the range of materials

< li>

Complex cutting contours can be achieved without additional setup times

7. No carbonization: no burning of material

8. Reproducible process quality due to cross-machine and calibrated process parameters

9. ;p>Flexible degree of automation: stand-alone or as part of a fully integrated production line