Thin film laser drilling machine

Thin film laser perforation machine has the advantage of laser focusing, and the focus point can be as small as the sub-micron level, which makes it more advantageous for micro-processing of thin films, and the cutting and drilling depth is controllable. Even at a low pulse energy level, a high energy density can be obtained, and materials can be processed effectively. Thin film laser perforation machine is a non-contact processing, and the perforation pattern can be set at will. At the same time, the machine has laser process functions such as marking, coding, easy-tear line, solid line, dotted line, half cutting, and full cutting.