Key Steps:

1. Laser Irradiation: The targeted areas on the circuit board are irradiated using a laser beam. The high energy density of the laser induces local heating and etching of the material.

2. Material Removal: The high energy of the laser causes localized heating, resulting in material evaporation, vaporization, or chemical reactions that remove or alter the conductive layer.

3. Precision Positioning: Laser etching systems typically incorporate highly accurate positioning systems to ensure the laser beam accurately targets the desired areas, achieving high-precision processing.

Advantages:

• High Precision: Laser etching provides high-precision machining, enabling the creation of intricate circuit structures and details.
• Non-contact: In contrast to traditional mechanical etching methods, laser etching is a non-contact process, avoiding mechanical stress and damage.
• Control: Laser parameters, such as energy density and irradiation time, can be adjusted for control over etching depth and shape.

Application Areas: Laser etching for heating element circuits finds widespread applications in electronic manufacturing, semiconductor fabrication, and circuit board production. It is used to manufacture microcircuits, sensors, RF antennas, and other high-precision electronic components.