Laser Ceramic Scribing

Laser etching on ceramic substrates creates a distinct fracture line in the material, allowing for clean and precise separation into individual sections.

Depending on the application requirements and the chosen laser source, utilize fixed optics or a mirror scanner to process the substrate. Ultrasonic pulse lasers generate scratch-free scribe lines and lower thermal material tension through a near-cold process.

Typical materials: AlOx, AlN, DCB substrates, composite ceramics.

 

Using Laser for Circuit Board Cutting

Advantages: Fast, flexible, residue-free

Scribing is a process employed for the pre-cutting of printed circuit boards. It establishes predetermined break points along the edges of the panels, allowing them to later break quickly and easily along these points.

All circuit boards with thickness ranging from 0.3 millimeters to 2 millimeters can undergo scribing.


What are the advantages of laser marking:

No mechanical stress or damage due to non-contact and vibration-free scraping

Increased throughput: circuit reliability significantly improved

Reduce material usage by optimizing utilization efficiency

Cutting edge technical cleanliness

Dust-free handling (by evaporation and suction of material)

Flexibility in material types

Achieve complex cutting profiles without additional setup time

No carbonization: no burning of materials

Reproducible process quality due to cross-machine and calibrated process parameters

Flexible levels of automation: stand-alone or as part of a fully integrated production line